Sunshine BGA Reballing Stencil for Phone Repair

Sunshine BGA Reballing Stencil for Phone Repair - 1

Details

Type
Other
Brand
Other
Condition
Brand New

Description

• Precision steel mesh template for CPU and IC chip tin planting during mobile phone board repair. • Designed for thermal reballing and aligning solder balls on smartphone integrated circuits. • Manufactured by Guangzhou Sunshine Electronics Technology under executive standard Q/XXDZ 014-2023. • Ensures accurate solder ball placement for reliable chip reinstallation. • Essential tool for professional mobile phone technicians and repair shops. • Compatible with various smartphone models requiring BGA chip work.

Compare

Sunshine BGA Reballing Stencil for Phone RepairThis item
Sunshine BGA Reballing Stencil for Phone Repair
USh 65,000
External DVD RW Drive - USB-C/USB 3.0
External DVD RW Drive - USB-C/USB 3.0
USh 60,000
3.5" External Hard Drive Enclosure (USB 3.0)
3.5" External Hard Drive Enclosure (USB 3.0)
USh 65,000
TypeOtherCD/DVD DrivesHard Drive Enclosures
BrandOtherOtherSeagate
ConditionBrand NewBrand NewBrand New
PriceUSh 65,000USh 60,000USh 65,000